ELECTRICALLY CONDUCTIVE SILICONE SEALANT
CHO-BOND 1038 is a silver-plated, copper-filled, one-component conductive silicone designed for use as a fillet, gap filler and seam sealant on electrical enclosures for EMI shielding or electrical grounding.
| Category | Sealants | Brand | Parker Hannifin |
| Part No. | CHO-BOND 1038/1086 | OEM Part No. | Not Avaliable |
| Alt Part No. | Not Avaliable | Country of Origin | Not Available |
| Pro Category | Not Available | Is Return | Yes |
The minimum recommended bond line for CHO-BOND 1038 is 0.007 inches (0.18mm). In addition, CHO-BOND 1038 may be used for EMI gasket repair, bonding, and attachment in applications where moderate strength (less than 150 psi) is required. CHO-BOND 1038's moisture cure silicone polymer system allows it to cure to the touch in 24 hours and provides a robust conductive and environmental seal over a wide range of application temperatures.
Its non-corrosive cure mechanism prevents the generation of corrosive by-products during curing to damage substrates.
CHO-BOND 1038 should be used in conjunction with CHOSHIELD 1086 primer (supplied in this kit) for best adhesion results. Typical applications include man portable electronics, radar and communication systems, EMI vents, military ground vehicles, and shelters.
CHO-BOND 1038/1086
